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Qualification Results for
ChipPAC Subcontractor Assembly
Of PDIP, PLCC, QFP & SOIC IC Packages
Earlier this year Intersil sold our package assembly operations in
Kuala Lumpur, Malaysia to ChipPAC, Inc. As part of the
agreement ChipPAC, Inc. was to be qualified for assembly of
Intersil's IC PDIP, PLCC, QFP and SOIC packages. In
addition to the previous Intersil Malaysian facility (now refered
to as CPM), ChipPAC also has assembly facilities in Shanghai, China
(CPS) and Ichon, S. Korea (CPK). This information was earlier
sent to you in Intersil's change notices PNC00061 and PCN00067. In the months since the
purchase Intersil has been performing extensive qualification
procedures and audits to certify CPS and CPK as alternate assembly
sites for our plastic packaged products. Based on the work
performed, Intersil has now approved CPS and CPK for assembly of
commercial IC PDIP, PLCC, QFP and SOIC products. The results
from the qualification process can be found below by clicking on
the appropriate package style. If you require any additional
information, please contact your Intersil sales representative.
Commercial Product Qualification Results
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