
G
Gallium Arsenide. A III-V compound semiconductor material used for making
optoelectronic devices and high-frequency ICs. GaAs has a higher electron mobility than
silicon, thus having the capability of producing higher-speed devices. Electrons in GaAs
travel at twice the speed of those of silicon.
Gallium Arsenide Field Effect Transistor. A
high-frequency voltage-controlled current amplifier similar to a silicon
MOSFET. Also
called GaAs MESFET (gallium arsenide metal semiconductor field effect transistor).
(1) The control electrode in a field-effect transistor (FET). A voltage applied
to the gate regulates the conducting properties of the semiconductor channel region, which
is usually located directly beneath the gate. In a MESFET (metal semiconductor field
effect transistor), the gate is in intimate contact with the semiconductor. In a MOSFET
(metal oxide semiconductor field effect transistor), it is separated from the
semiconductor by a thin oxide, typically 100-1000 angstroms thick. (2) A
combination of transistors which form a circuit that performs a logic function, such as
NAND or NOR. See also channel, drain,
FET, MESFET, MOSFET
and source.
A semicustom IC consisting of a regular arrangement of gates that are interconnected
through one or more layers of metal to provide custom functions. Generally, gate arrays
are preprocessed up to the first interconnect level so they can be quickly processed with
final metal to meet a customer's specified function.
Physical distance between source and drain of a MOS transistor measured on the
photomask plate. Also called "patterned" or "drawn" gate length. When
determined from the actual transistor characteristics, called "effective" gate
length. See source and drain.
A common lead form used to interconnect surface mounted packages to the printed-circuit
board.
