
H
The physical components of a circuit or system, both passive and active. Compare software.
Conditions such as radiation exposure, temperature extremes, vibration, and dirt
encountered by the military, on factory floors, and under the hoods of automobiles.
Addressed by radiation hardening ICs and other rugged process technologies, an area in
which Intersil is a world leader. See radiation
hardened circuit.
A Intersil BiCMOS mixed-signal wafer process developed to provide high integration of
logic as well as precision analog capability. It has also been optimized for both A-to-D
and D-to-A data conversion. See BiCMOS, A/D converter, D/A converter.
An application-oriented programming language, as distinguished from a machine-oriented
programming language. The instruction approach is closer to the needs of the problems to
be solved than it is to the language of the machine on which it is to be run. Examples are
Ada, C, COBOL, FORTRAN, Lisp and Pascal.
A mobile electron vacancy in a semiconductor that acts like a positive electron charge
(+1.6x10-19 coulomb) with a positive mass. Unoccupied spot among the electrons
that are bound in their orbits. Under the application of an electric field, holes move in
the opposite direction from electrons, thereby producing an electric current. Holes are
induced into an integrated circuit by adding small quantities of an acceptor dopant to the
host silicon crystal. See acceptor.
High-Voltage Integrated Circuit. Utilizes DI (dielectric
isolation) and JI (junction isolation) technologies to provide circuits that convert
high-voltage incoming AC lines (120 and 240 volts, for example) to regulated DC output. A
key point of Intersil's analog strategy in applying existing process capabilities to new
markets, HVICs are cost-effective monolithic replacements for transformers, rectifiers and
regulators. See DI and JI.
(1) A combination of passive and active subminiature devices on an insulating
substrate to perform a complete circuit function. (2) A combination of one or more
integrated circuits with one or more discrete components. (3) The combination of
more than one type of integrated circuit into a single package.
