
L
An undesirable phenomenon in which either a PNPN or an NPNP thyristor-type parasitic
structure suddenly turns to an "on" state, thereby bypassing or shorting out
portions of an IC. To prevent latch-up, Intersil uses either epitaxy layers to avoid
diffused pockets or a retrograde P-well, which is designed to specifically avoid latch-up.
See epitaxy
Leadless Chip Carrier. A surface-mounted package having metallized
contacts (terminals) at its periphery. Usually made of ceramic material.
Lightly Doped Drain. See doping and drain.
A stamped or etched metal frame, usually connected to the bonding pads of a die by wire
bonding, that provides external electrical connections for a packaged electrical device.
Light-Emitting Diode. A semiconductor P-N junction diode that
emits light under forward-bias conditions. The wavelength of the emitted light is a
function of the semiconductor material. The crystal structure of silicon does not provide
useful levels of light emission, but the structure of GaAs does, with an infrared emission
wavelength.
The term used to designate the collection of representations required by the various
design tools. These representations, such as symbol, simulation model, layout abstract,
transistor schematic, are used by the different tools in the design system to create or
analyze some portion of the IC or otherwise aid in the design process. Creating a design
library is effectively inserting the fabrication technologies into the design system in a
form that allows designers to create circuits in the most efficient manner.
(1) Having an output that varies in direct proportion to the input. (2) A
ratio in which a change in one of two related quantities is accompanied by a directly
proportional change in the other.
An amplifying-type, analog device with a linear input/output relation, as opposed to a
non-linear, digital device, which is either completely "on" or completely
"off" over large ranges of input signals.
A circuit whose output is an amplified, linear version of its input or whose output is
a predetermined variation of its input. A class of integrated circuits that process analog
information expressed as voltages or currents.
The transfer of a pattern or image from one medium to another, as from a mask to a
wafer. If light is used to effect the transfer, the term "photolithography"
applies. "Microlithography" refers to the process as applied to images with
features in the micrometer range. See also aligner, mask, stepper, and X-ray lithography.
LOCalized Oxidation Of Silicon. See silicon.
Mathematical treatment of formal logic in which a system of symbols is used to
represent quantities and relationships. AND, OR and NOT are examples of symbols of logical
functions. Each function can be translated into a switching circuit, or gate. Since a
switch (or gate) has only two states--open or closed--it makes possible the application of
binary numbers for solution of problems. The basic logic functions obtained from gate
circuits is the foundation of computing machines. Intersil manufactures a broad line of
logic circuits in CMOS technology.
A MOSFET with low operating voltages that can operate directly from a microprocessor or
5V logic instead of from the 10V usually supplied by IC buffer stages. Logic-level MOSFETs
can eliminate the need for buffers. See MOSFET.
Optimization of logic circuits for either area or speed using a tool such as the
Synopsys Design Compiler.
Synthesis of gate level logic circuits from behavioral descriptions using a tool such
as the Synopsys Design Compiler.
Low Pressure Chemical Vapor Deposition. See deposition.
Large-Scale Integration. Integrated circuits containing between
100 and 5000 gate equivalents, or 1000 to 16,000 bits of memory. Over the years,
integration levels have progressed from SSI (small-scale integration), MSI (medium-scale
integration), and LSI, to today's VLSI (very-large scale integration).
| Type |
Chip Area |
No. of Gates |
Memory (bits) |
Typical Intersil Product |
| SSI |
<10k sq-mils |
<10 |
----- |
Quad 2 input NAND gates |
| MSI |
10-25k sq-mils |
10-100 |
<1000 |
Set/Reset J-K Flip Flop |
| LSI |
25-100k sq-mils |
100-5000 |
1-16k |
82Cxx "Intel" peripherals |
| VLSI |
>100k sq-mils |
>5000 |
>16k |
80C286 µP, NCOM (DSP) |
| ULSI |
>1000k sq-mils |
>50,000 |
>256k |
256k Rad Hard SRAM |
Layout Versus Schematic. Compares the electrical design
(schematic) with the physical design (layout) to ensure what will be built is what was
designed.
