W
A thin slice, typically 10-30 mils thick, sawed from a cylindrical ingot
(boule) of
bulk semiconductor material (usually silicon), four to eight inches in diameter. Arrays of
ICs or discrete devices are fabricated in the wafers during the manufacturing process. See
Czochralski, IC, mil, silicon.
Wafer Acceptance Test. See wafer.
The most common method of making the electrical inter- connection from the chip to the
leads on a package There are three basic methods: thermal compression, ultrasonic, and
pulse. The wires are typically made of either aluminum or gold and are usually 1.25 to
1.50 mils in diameter for ICs but can be as large as 15 mils in diameter for power
devices. See mil.
Wafer Level Reliability. See wafer.
