 | Potential lower cost |
| Continuous product improvement programs |
| Greater product variety |
| Mechanically more rugged |
| Lighter weight |
| Available in smaller/thinner packages (SMT) |
| TCE more closely matches that of most PCBs |
| More automated assembly methods |
| Higher volume and more cost effective production |
| Qualification requirements generally more stringent than
Mil-Std-883 |
| Reliability monitoring generally more frequent than
Mil-Std-883 |
| More suppliers resulting in greater competition |
| Ongoing demands for higher quality and reliability levels by commercial users |
