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RELIABILITY CONSIDERATIONS FOR USING PLASTIC-ENCAPSULATED
MICROCIRCUITS IN MILITARY APPLICATIONS

William L. Schultz and Sheldon Gottesfeld
Intersil Corporation
Melbourne, Florida
Copyright Intersil Corporation 1994

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ABSTRACT
INTRODUCTION
ADVANTAGES AND LIMITATIONS OF PEMs
FAILURE MECHANISMS OF PEMs AND HSMs
COMPARISON OF PLASTIC AND HERMETIC RELIABILITY DATA
APPLICATIONS ENVELOPE FOR PEMs
BEST PRACTICES FOR DESIGNING IN QUALITY AND RELIABILITY
BEST PRACTICES RECOMMENDED FOR PRODUCT HANDLING AND PROCESSING
SUMMARY AND CONCLUSIONS
ACKNOWLEDGEMENTS
REFERENCES
APPENDIX

Mil Plastic - 30 AUG 94

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