Reliability Engineering



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Publications
Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) (Tech Brief tb363.2) Guidelines for Soldering Surface Mount Components to PC Boards (Tech Brief tb334.2) Decreasing Moisture Content of Epoxy Calculation of Semiconductor Failure Rates Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications Use of Life Tested Parts (App Note an9654) Estimated Failure Rates for Class T Products